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P205: Technologies for LED Chip, Packaging and Modules- SSLCHINA

SSLCHINA Series Conferences


The rapid development of white LED in the past ten years has been focusing on light efficiency and cost. Under the environment of new economy and new driving forces in 13th Five Year Plan, what are the development opportunities for LED industry? What is the latest development of manufacturing technology of chip and package? High color rendering, full-spectrum LED light source …. Flip chip LED into the mature period, its performance advantage and price adjustment affects not only the market trend of chip, but also the technology trend of package and module. The wide application of flip chip promotes the technological revolution of chip scale package (CSP) and FC-COB with high power and high light density, changes the situation that traditional package stents and high-power ceramic package occupy important position. Recently GaN on Si based LED won the National Science and Technology Invention Award, become a hot topic in the industry again, how does it change market prospects of chip and packaging applications?

What is the latest progress and development tendency of technologies, such as LED chip process, package material, fluorescent powder coating, lens design, wafer level package and integrated optical engine driven by high voltage AC (DOB)?  What role do these technologies play in the industrial structure change in the future? Please pay attention to the latest development of chip, package and module technology.


Session Chairs

JIANG Fengyi——Vice President and Professor of Nanchang University

Jay. Guoxu LIU——Executive Vice President & CTO of ShineOn (Beijing) Technology

Session Members

YUN Feng——Professor of Xi'an Jiaotong University

YI Xiaoyan——Professor of Institute of Semiconductors, Chinese Academy of Sciences

MO Qingwei——Deputy Director of Elec-Tech International

GUO Weiling——Professor of Beijing University of Technology

ZHANG Jianli——Professor of Nanchang University


P205:半导体照明芯片、封装及模组技术/ LED Chip, Packaging, and Modules

时间:20201124日上午09:00-12:00

地点:深圳会展中心•六层郁金香厅

Time: Nov 24th, 2020 Morning 09:00-12:00

Location: Shenzhen Convention and Exhibition Center 6th Floor Tulip Hall

主持人

Moderator

江风益/JIANG Fengyi

中国科学院院士,南昌大学副校长、教授,国家硅基LED工程技术研究中心主任 /Academician of Chinese Academy of Sciences, Vice President & Professor of Nanchang University, Director of National Silicon-Based Semiconductor Lighting Engineering Technology Research Center

刘国旭/Jay Guoxu LIU

易美芯光(北京)科技有限公司执行副总裁兼CTO / Executive Vice President & CTO of ShineOn (Beijing) Technology

09:00-09:25

具有较好显色性和提高3dB调制带宽的无荧光粉单芯片GaN基白光LEDPhosphor-free Single Chip GaN-based white light emitting diodes with moderate color rendering index and significantly enhanced communications bandwidth

汪炼成--中南大学特聘教授微电子科学与工程系副主任

WANG  Liancheng--Distinguished Professorof Deputy Director of the Department of Microelectronics Science and Engineering, Central South University

09:25-09:45

通过各向异性导电胶(ACP)和无针孔晶圆直接技术的自对准,优化和量化“ mini LED板上芯片(COB)封装”Optimization and quantification of "mini LED flip chip on board(COB) package" by self-alignment with anisotropic conductive paste(ACP) and pinhole free wafer direct technology

平木和雄--日本铃木工艺技术员、LED项目经理

Kazuo Hiraki--Process Technologist & LED Project Manager of Suzuki Co., Ltd, Japan

9:45-10:05

超高色域显示用荧光粉发展趋势 The development trend of phosphors for ultra high color gamut display

刘荣辉--有研稀土新材料股份有限公司副总经理、教授级高级工程师

LIU Ronghui--Professor & Deputy General Manager of Grirem Advanced Materials Co.,Ltd.

10:05-10:25

大功率单片集成倒装芯片发光二极管:基于自对准隔离技术High-Power Monolithically intergrated Flip-Chip Light-Emitting diodes: Based on Self-aligning Isolation  Technology

吴林枫--中国科学院苏州纳米技术与纳米仿生研究所

Wu Linfeng--Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), CAS

10:25-10:40

茶歇/Coffee Break

10:40-11:00

基于金属纳米二聚体阵列的CsPbBr3钙钛矿量子点色转换等离激元耦合增强Plasmonic Coupling Enhanced Color-conversion of Inorganic CsPbBr3 Perovskite Quantum Dots based on Metal Nanodimer Arrays

尹君--厦门大学萨本栋微米纳米科学技术研究院副教授

YIN Jun--Associate professor of Pen-Tung Sah Institute of Micro-Nano Science and Technology Xiamen University

11:00-11:20

面向液晶显示背光应用的红光钙钛矿量子点光学膜研究

李飞--北京理工大学

LI Fei--Beijing Institute of Technology

 

11:20-12:00

PanelDiscussion

1.     无荧光粉白光LED与荧光粉转换白光LED的优劣势及各自在未来应用的方向

2.     荧光粉与量子点作为色转换材料的优劣势及各自在LED照明和显示应用的趋势 

Modulator:

刘国旭/Jay Guoxu LIU

易美芯光(北京)科技有限公司执行副总裁兼CTO

讨论嘉宾:

汪炼成--中南大学特聘教授,微电子科学与工程系副主任

解荣军--厦门大学材料学院教授

刘荣辉--有研稀土新材料股份有限公司副总经理、教授级高级工程师

梁超--博睿光电科技有限公司副总经理

尹君--厦门大学萨本栋微米纳米科学技术研究院副教授

12:00-14:00

午休/Adjourn