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P205: Technologies for LED Chip, Packaging and Modules- SSLCHINA

SSLCHINA Series Conferences


The rapid development of white LED in the past ten years has been focusing on light efficiency and cost. Under the environment of new economy and new driving forces in 13th Five Year Plan, what are the development opportunities for LED industry? What is the latest development of manufacturing technology of chip and package? High color rendering, full-spectrum LED light source …. Flip chip LED into the mature period, its performance advantage and price adjustment affects not only the market trend of chip, but also the technology trend of package and module. The wide application of flip chip promotes the technological revolution of chip scale package (CSP) and FC-COB with high power and high light density, changes the situation that traditional package stents and high-power ceramic package occupy important position. Recently GaN on Si based LED won the National Science and Technology Invention Award, become a hot topic in the industry again, how does it change market prospects of chip and packaging applications?

What is the latest progress and development tendency of technologies, such as LED chip process, package material, fluorescent powder coating, lens design, wafer level package and integrated optical engine driven by high voltage AC (DOB)?  What role do these technologies play in the industrial structure change in the future? Please pay attention to the latest development of chip, package and module technology.


Session Chairs

JIANG Fengyi——Academician of Chinese Academy of Sciences,Vice President and Professor of Nanchang University

Jay. Guoxu LIU——Executive Vice President & CTO of ShineOn (Beijing) Technology

Session Members

YUN Feng——Professor of Xi'an Jiaotong University

YI Xiaoyan——Professor of Institute of Semiconductors, Chinese Academy of Sciences

MO Qingwei——Deputy Director of Elec-Tech International

GUO Weiling——Professor of Beijing University of Technology


P205:半导体照明芯片、封装及模组技术/ LED Chip, Packaging, and Modules

主持人

Moderator

江风益/JIANG Fengyi

中国科学院院士、南昌大学副校长、教授、国家硅基LED工程技术研究中心主任/Vice ,Academician of Chinese Academy of Sciences,President & Professor of Nanchang University, Director of National Silicon-Based Semiconductor Lighting Engineering Technology Research Center

刘国旭/Jay Guoxu LIU

易美芯光(北京)科技有限公司执行副总裁兼CTO / Executive Vice President & CTO of ShineOn (Beijing) Technology

演示文件建议尺寸比例/Recommend Slides Size4:3

半导体照明芯片、封装及模组技术I / LED Chip, Packaging, and Modules I

时间:20191126日下午14:00-17:00

地点:深圳会展中心•五层玫瑰厅2

Time: Nov 26th, 2019 Afternoon 14:00-17:00

Location: Shenzhen Convention and Exhibition Center 5th Floor Rose Hall 2

14:00-14:25

LEDLED封装的未来趋势

Possible Futures for LEDs and LED Packaging

Robert F. KARLICEK    美国智能照明工程技术研究中心主任, 美国伦斯勒理工学院教授

Robert F. KARLICEK    Director of Smart Lighting Engineering Research Center, Professor of Rensselaer Polytechnic Institute 

14:25-14:50

超越照明 | 光电器件技术发展现状、突破点及应用趋势

Beyond Illumination | Latest Photonics Technology, Breakthrough and Application Trend

邵嘉平    欧司朗光电半导体(中国)有限公司 销售负责人

SHAO Jiaping   Head of Sales,OSRAM Opto Semiconductors ChinaCo., Ltd.

14:50-15:15

针对类太阳光和植物光照应用的紫外激发白光LED

Violet Chip Excited White LEDs for Sun-Like Lighting and Horticulture Lighting

刘国旭    易美芯光(北京)科技有限公司执行副总裁兼首席技术官

Jay Guoxu LIU   Executive Vice President & CTO of ShineOn (Beijing) Technology

15:15-15:40

紫光激发高效三基色稀土荧光粉暖白光LED的研究及其应用

Research and application for warm white LED of high-efficiency tri-color rare earth Phosphors by purple light Excitation

陈朝   厦门大学教授

CHENChao   ProfessorofXiamenUniversity

15:40-15:55

茶歇/Coffee Break

15:55-16:15

大功率照明用荧光材料研发进展

Recent progress of fluorescent materials for high-power LED

刘荣辉   有研稀土新材料股份有限副总经理、教授级高级工程师

LIU Ronghui  Professor & Deputy General Manager of Grirem Advanced Materials Co.,Ltd. 

16:15-16:35

设计制造复合金属等离激元同时提高GaN LED效率和显色指数研究

Simultaneously improve the luminous efficiency and color rendering index of GaN-based white light emitting diodes using metal localized surface plasmon resonance

汪炼成    中南大学教授

WANG Liancheng   Professor of Central South University

16:35-16:55

烧结银芯片连接工艺与石墨烯覆铜基板对紫外LED封装的热模拟分析

Thermal Simulations of a UV LED module with nanosilver sintered die attach process on graphene coated copper substrates

刘盼    复旦大学副研究员

LIUPan   Associate   Researcher  of Fudan University

16:55-17:15

Optimization of general and special color rendering index with red quantum dots for white LEDs

南方科技大学

South University of Science and Technology of China

半导体照明芯片、封装及模组技术II / LED Chip, Packaging, and Modules II

时间:20191127日上午 09:00 -12:00

地点:深圳会展中心•五层玫瑰厅2

Time: Nov 27th, 2019 Morning 09:00 -12:00

Location: Shenzhen Convention and Exhibition Center 5th Floor Rose Hall 2

09:00-09:25

Mini/Micro-LED的巨量转移及封装集成技术研究进展

Recent progress on massive transfer and integration technologies of Mini & Micro-LEDs

龚政   广东省半导体产业技术研究院教授、首席科学家

GONG Zheng    Professor and Chief Scientist of Guangdong Institute of Semiconductor Industrial Technology

09:25-09:50

针对小尺寸 LED衬底的各向异性导电胶和夹环的简化工艺

Anisotropic Conductive Paste and Grip Ring Direct process for mini LED die attachment

平木和雄 日本铃木工艺技术员

Kazuo HIRAKI    Process Technologist of Suzuki Co., Ltd., Japan

09:50-10:15

面向下一代主动驱动、高分辨GaN μ-LED显示

Monolithic Integrated Device of GaN Micro-LED with Graphene Transparent Electrode and Graphene Driving Transistor

孙捷 福州大学教授

SUNJie    Professorof Fuzhou University

10:15-10:35

面向长波段与低电流密度的硅基氮化镓 LED

GaN/Si LEDs: Towards Longer Wavelength and Smaller Current Density

张建立 南昌大学研究员

ZHANG  Jianli Professor  of   Nanchang  University

10:35-10:50

茶歇/Tea Break

10:50-11:10

InGaN基超高光效LEDs研究进展

Recent Advances in Achieving Ultra-High Efficiency InGaN-based LEDs

张逸韵   中国科学院半导体研究所副研究员

ZHANG  Yiyun    Associate  Professor of  Institute of Semiconductors, CAS

11:10-11:30

空气腔结构在GaN基垂直结构LED工艺中的影响

The effect of air-cavity structure on the process of vertical GaN-based light emitting diodes

张敏妍   西安交通大学助理研究员

ZHANGMinyan    Assistant Professor of Xi’an Jiaotong University


11:30-11:50

通过新一代智能制造系统提升三代半导体生产效率

Improving manufacturing efficiency of third-generation compound semiconductor devices with new smart manufacturing systems

刘斌 深圳埃克斯工业自动化有限公司首席技术官

LIU Bin CTO of Shenzhen IKAS Industrial Automation Co., Ltd