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P210: Technologies for Reliability and Thermal Management-SSLCHINA & IFWS

SSLCHINA & IFWS Series Conferences


Chip junction temperature has always been an important factor limiting the function and lifetime of semiconductor devices, related thermal management technologies and reliability analysis have been involved from making a single product to managing the entire system. In the process, reliability of the whole system will be affected by advances in technologies such as novel materials for heat dissipation, thermal management technology, reliability-oriented design, fault data and failure analysis, control and reliability screening in manufacturing process, accelerated life testing method, failure mode and simulation, etc.


Session Chairs

ZHAO Lixia——Professor&Dean of College of Electrical Engineering and Automation, Tiangong University

LUO Xiaobing——Professor of Huazhong University of Science and Technology

Session Members

Shi-Wei. Ricky LEE——Professor at Hong Kong University of Science and Technology

LIU Sheng——Professor of Wuhan University

GUO Weiling——Professor of Beijing University of Technology

YANG Daoguo——Professor and the Dean of School of Mechanical and Electrical Engineering Guilin University of Electronic Technology

P210: 可靠性与热管理技术/ Technologies for Reliability and Thermal Management

时间:20201124日上午09:00 -12:00

地点:深圳会展中心•五层玫瑰厅1

Time: Nov 24th, 2020 Morning 09:00 -12:00

Location: Shenzhen Convention and Exhibition Center 5th FloorRoseHall1

主持人

Moderator

赵丽霞/ZHAO Lixia

天津工业大学电气工程与自动化学院院长、教授/ Professor&Dean of College of Electrical Engineering and Automation, Tiangong University

罗小兵/LUO Xiaobing

华中科技大学能源与动力工程学院院长,中欧清洁与可再生能源学院中方院长

Professor&Dean of School of Energy and Power Engineering, China-Europe School for Clean and Renewable Energy, Huazhong University of Science and Technology

09:00-09:25

光电子和电力电子设备的互连可靠性的非破坏性测试Non destructivetesting of interconnect reliability for opto-and power electronics

Gordon ELGER--德国英戈尔施塔特应用技术大学教授

Gordon ELGER--Professor at University of Applied Science Ingolstadt (Technische Hochschule Ingolstadt), Germany

09:25-09:50

新型电极结构LED的特性和可靠性研究

The property and reliability of novel electrode LED

郭伟玲--北京工业大学教授、光电子技术教育部重点实验室副主任

Winnie Guo--Professor of Beijing University of Technology

09:50-10:05

Y2O3-CaF2LEDAlN封装基板性能的影响

The effects of Y2O3-CaF2 on the properties of AlN packaging substrate

梁超--江苏博睿光电有限公司副总经理

LIANG Chao--Deputy manager of Jiangsu Bree Optronics Co.,ltd

10:05-10:20

PWM脉冲驱动模式下UVLED动态结温的无量纲化拟合研究 Correlation between Empirical Modeling and T3ster Measurements for the Thermal Characterization of UVLED

赵惠珊--佛山市香港科技大学LED-FPD工程技术研究开发中心&港科技术(佛山)有限公司技术总监

ZHAO Huishan--Technical Director of HKUST LED-FPD Technology R&D Center at Foshan GK Tech Co. Ltd

10:20-10:35

1.5MeV电子束辐照对GaN / InGaN MQW结构的影响

1.5MeV electron beam irradiation effects on GaN/InGaN MQW structures

于莉媛--天津工业大学电气工程与自动化学院副教授

YU Liyuan--Associate Professor of Tiangong University

10:35-10:50

茶歇/Coffee Break

10:50-11:15

三族氮化物功率半导体发展动态及其可靠性的相关思考Status of III-Nitride Power Semiconductor Device and Relevant Consideration about its Reliability issue

刘扬--中山大学电力电子及控制技术研究所所长,教授

LIU YANG--Director of Institute of power electronics and control technologySun Yat-sen University

11:15-11:35

可靠性设计的发展和挑战Trends and Challenges in Design for Reliability

樊嘉杰--复旦大学青年研究员

FAN Jiajie--Youth Professor ofFudan University

11:35-11:50

 n4H-SiCTi/TiN/Pt欧姆接触电极在空气中高温退火处理的失效机理研究

Failure Mechanism of Ti/TiN/Pt Ohmic Contacts to n-type 4H-SiC after High Temperature Annealing Treatment in Air

刘成艺--电子科技大学

LIU Chengyi--University of Electronic Science and Technology of China

11:50-12:05

多场载荷下功率器件IGBT寿命预测分析

Prediction and analysis of IGBT life of power device under multi-field load

王浩洁--桂林电子科技大学

WANG Haojie--Guiling University of Electronic Technology