FORUM
Exhibition
ONLINE
TEL
Tel:010-82387600
TOP

P210: Technologies for Reliability and Thermal Management-SSLCHINA & IFWS

SSLCHINA & IFWS Series Conferences


Chip junction temperature has always been an important factor limiting the function and lifetime of semiconductor devices, related thermal management technologies and reliability analysis have been involved from making a single product to managing the entire system. In the process, reliability of the whole system will be affected by advances in technologies such as novel materials for heat dissipation, thermal management technology, reliability-oriented design, fault data and failure analysis, control and reliability screening in manufacturing process, accelerated life testing method, failure mode and simulation, etc.


Session Chairs

Shi-Wei. Ricky LEE——Professor at Hong Kong University of Science and Technology

LIU Sheng——Professor of Wuhan University

Session Members

ZHAO Lixia——Professor of Institute of Semiconductors, Chinese Academy of Sciences

GUO Weiling——Professor of Beijing University of Technology

YANG Daoguo——Professor and the Dean of School of Mechanical and Electrical Engineering Guilin University of Electronic Technology

LUO Xiaobing——Professor of Huazhong University of Science and Technology


P210: 可靠性与热管理技术/ Technologies for Reliability and Thermal Management

时间:20191126日上午09:00 -12:00

地点:深圳会展中心•五层玫瑰厅1(PPT显示比例:4:3)

Time: Nov 26th, 2019 Morning 09:00 -12:00

Location: Shenzhen Convention and Exhibition Center 5th Floor Rose Hall 1   PPT scale  4:3

主持人

Moderator

刘胜/LIU Sheng

武汉大学教授、院长/Professor & Dean of Wuhan University

李世玮/ Shi-Wei.Ricky LEE

香港科技大学先进微系统封装中心主任、香港科技大学深圳研究院常务副院长/ Professor and Director of Center for Advanced Microsystems Packaging (CAMP) of Hong Kong University of Science and Technology. 

09:00-09:25

Junction Temperature Monitoring of the Multi-LED Module in Service with the Thermal Resistance Matrix

李世玮    香港科技大学先进微系统封装中心主任、香港科技大学深圳研究院常务副院长

Shi-Wei.Ricky LEE    Professor and Director of Center for Advanced Microsystems Packaging (CAMP) of Hong Kong University of Science and Technology. 

09:25-09:50

Manipulation of microparticles into 3D matrix patterns using standing surface acoustic waves (SAW) microfluidics

DU Hejun    新加坡南洋理工大学副教授

DU Hejun    Associate Professor of Nanyang Technological University, Singapore

09:50-10:15

量子点LED封装的内部热管理

Internal thermal management of quantum dot LED packaging

罗小兵    华中科技大学能源与动力工程学院院长,中欧清洁与可再生能源学院中方院长

LUO Xiaobing    Professor & Dean of School of Energy and Power Engineering, China-Europe School for Clean and Renewable Energy, Huazhong University of Science and Technology

10:15-10:40

高压LED及其可靠性研究

High voltage light emitting diode and its reliability

郭伟玲    北京工业大学教授

GUO Weiling    Professor of Beijing University of Technology

10:40-10:55

茶歇/Coffee Break

10:55-11:20

A Comparative Study of the Life-Times of High-End and Low-Cost Off-Line LED Drivers Under Accelerated Test Conditions

Ferdinand KEIL    德国达姆施塔特工业大学研究助理

Ferdinand KEIL    Research Assistant of Technische Universität Darmstadt, Germany

11:20-11:40

适用于可见光通信高带宽微发光二极管的可靠性分析

Reliability of High Bandwidth Micro-LEDs for Visible Light Communication

马占红    中国科学院半导体研究所

MA Zhanhong    Institute of Semiconductors, Chinese Academy of Science

11:40-12:00

汽车前照灯用LED阵列模组的光、热设计

Optical-Thermal Design of LED Matrix Module for Automotive Headlamps

陈威    半导体照明联合创新国家重点实验室(常州基地)研发工程师

CHEN Wei    Research Engineer of Changzhou Institute of Technology Research for Solid State Lighting