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17th China International Forum on Solid State Lighting

& 2020 International Forum on Wide Bandgap Semiconductors

 

Call for Papers

 

China International Forum on Solid State Lighting SSLCHINAis a global high level forum sponsored by China Solid State Lighting Alliance (CSA) aiming at promoting the international exchange and cooperation of semiconductor lighting technology and application and lead the development direction for the emerging semiconductor lighting industry, comprehensively cover innovative development of technology and equipment, raw materials, epitaxial chippackaging products and applications of the industry, provide the whole industry chain cooperation platform on a worldwide scale, and commit to expand the target market concerned by the industry. In the past 15 years, SSLCHINA has presented more than 1700 lectures from the top SSL scholars worldwide including the Nobel laureates. The cumulative number of participants is larger than 25,000 from more than 70 countries.

International Forum on Wide Bandgap Semiconductors ChinaIFWSis a global high level forum sponsored by the China Advanced Semiconductor Industry Innovation Alliance (CASA). The forum aims to promote collaborative innovation of industries including wide bandgap semiconductor materials, equipments, devices and related applications. Connecting research and industry, the forum focuses on the roadmap, application needs, integrated innovation of wide bandgap semiconductor technology and other topics, divided into several sessions for in-depth discussions. In the past three years, IFWS invites the world's top academic speakers in the field of wide bandgap semiconductors to share the most advanced technological trends. The forum has developed into a comprehensive professional forum with industry influence.

Since 2016, SSLCHINA and IFWS have been held concurrently to join forces and to present a brighter future with LED+ and advanced electronic materials to the audience.

 

Accepted papers will be published in IEEE Explore in the form of conference proceedings and submitted to EI Compendex.

 

DateNovember. 25-27, 2019

Venue Shenzhen Convention & Exhibition Center Ÿ Guangdong Ÿ China

Hosts

China Solid State Lighting Alliance (CSA)

China Advanced Semiconductor Industry Innovation Alliance (CASA)

Technical Program Committee

Chair

ZHANG Rong——President and Professor of Xiamen University


CONTENTS

 

P201: The Technology in Substrate, Epitaxy and Wafer Growth Equipment (SiC & GaN)

Silicon Carbide (SiC) and Gallium Nitride (GaN) are probably the most popular Wide band-gap semiconductor materials whose importance cannot be overestimated in the power devices for high frequency applications and the quality of the material directly determines the performance of the device.  The themes of this section cover the materials for substrate, homo/heteroepitaxial growth, characterization and associated equipment which ultimately lead to the discussion from mechanism to industrial production. World leading scientists have been invited to this conference who will demonstrate their most recent development in specified areas.

 

Scope:

- The influence of Materials on Epitaxy (MO source, other PVD source and epitaxial mechanism)

- The Growth and Manufacture of Wafer

- Homo/Heteroepitaxy

- Defects and Characterization

- The Progress of Equipment in Research, Manufacture and Detection

 

P202: Technologies for Power Electronic Devices and Packaging (SiC & GaN)

As typical of Wide band-gap semiconductor materials, SiC and GaN represent the development direction of power electronic devices, and have great potential application in the new generation of electric power conversion and management system with high efficiency and small size such as electric vehicles, industrial motors, etc .

SiC/GaN power devices with novel structures and processes, gate drive design, the design and manufacture of power modules with high speed and high efficiency, reliability and applications in SiC/GaN based power system, etc. The latest progress in power electronic devices based on SiC and GaN will be presented.

 

Scope:

-  SiC/GaN based power system

-  SiC/GaN Power electronics devices gate driver design

-  SiC/GaN Power electronics devices packaging technology

-  SiC/GaN Power electronics devices application

-  SiC/GaN Power electronics devices reliability

-  SiC/GaN Power electronics devices market research

 

P203: RF Technology and 5G Mobile Communication

Featured with High frequency, high efficiency and high power, the wide band gap semiconductor GaN based RF devices are now representing the great potential for the new generation of mobile communication technology. The breakthrough in this specific area is the new strategic highland of global semiconductor industry. The topics in this session cover GaN microwave devices and MMIC epitaxy, model, design and manufacturing, reliability and applications in mobile communications. The domestic and foreign well-known experts will be invited to give talks in this session. The latest progress of microwave devices and applications in wide bandage semiconductor will be presented.

 

Scope:

- High Efficiency GaN Microwave Device Technology

- GaN Epitaxial Technology for High Efficiency Microwave Device

- GaN Monolithic Microwave IC Design

- Process and Device Reliability of GaN Microwave Devices

- Large Signal Equivalent Circuit Modeling and Physical Modeling of GaN Microwave Devices

- Application of GaN devices and circuits in mobile communication

- Application of GaN HEMT Device in 5G Mobile Communication

 

P204: Solid-State Ultraviolet Device Technology

In recent years, people continue to get a breakthrough in the research and application of ultra-wide bandgap semiconductor materials represented by diamond, gallium oxide, aluminum nitride, boron nitride, etc. The ultra-wide bandgap semiconductor materials have a larger bandgap, higher thermal conductivity and better material stability, which have significant advantages and great potential for developing new generation of deep ultraviolet optoelectronic devices, high voltage/power electronic devices and other significant applications. This session focuses on the fabrication of the ultra-wide bandgap semiconductor materials, process technology, key equipment and device applications, aims at building a high-quality exchange platform for the communication among industry, academia and capital, discusses the new technologies and new trends of the ultra-wide bandgap semiconductor materials and devices.

 

Scope:

- AIN and Other Novel Substrate Materials for UV Optoelectronic Devices

- Design and Epitaxial Growth of Nitride Semiconductor UV Light Emitting and Detecting Materials

- P - Type Doping of AlGaN epitaxial films with High Al Composition

- High Efficiency Solid State Ultraviolet Light Emitting Devices

- High Sensitivity Ultraviolet Detection and Imaging Devices

- Light Extraction, Thermal Management and Reliability of Packaging and Modules of UV Light Source

- New Progress of Ultraviolet UV Semiconductor Materials and Devices

 

P205: LED Chip, Packaging and Modules 

The rapid development of white LED in the past ten years has been focusing on light efficiency and cost. Under the environment of new economy and new driving forces in 13th Five Year Plan, what are the development opportunities for LED industry? What is the latest development of manufacturing technology of chip and package? High color rendering, full-spectrum LED light source …. Flip chip LED into the mature period, its performance advantage and price adjustment affects not only the market trend of chip, but also the technology trend of package and module. The wide application of flip chip promotes the technological revolution of chip scale package (CSP) and FC-COB with high power and high light density, changes the situation that traditional package stents and high-power ceramic package occupy important position. Recently GaN on Si based LED won the National Science and Technology Invention Award, become a hot topic in the industry again, how does it change market prospects of chip and packaging applications?

What is the latest progress and development tendency of technologies, such as LED chip process, package material, fluorescent powder coating, lens design, wafer level package and integrated optical engine driven by high voltage AC (DOB)?  What role do these technologies play in the industrial structure change in the future? Please pay attention to the latest development of chip, package and module technology.

 

Scope:

- New Progress of LED Chip Manufacturing Technologies

- High Efficient UV, Blue, Green and Red Chip Technology

- Mounted Chips, Flip Chip and Vertical Chip Technology

- Latest Development of LED Packaging Materials (Substrate, Solid Crystal Materials, Silica Gel, Fluorescent Powder, etc.)

- Fluorescent Powder, Quantum Dot Technology and Coating Technology

- Lens Design and Optic Module

- Chip level and Wafer Level Packaging Technology

- Multi-chip Packaging, Design and Optimization of COB

- New Development of Light Source with High Quality and Full Spectrum

- Advanced Packaging Technology and Manufacturing Technology with High Sigma and Low Color Tolerance

- The New Generation of LED Light Source and Light Engine

 

P206: LED Lighting in Bio-Agriculture

Light is one of the most important factors in agricultural production, which plays a pivotal role in regulating growth and development of animal and plant as well as microorganism, and plays irreplaceable role in achieving high yield, high quality and high efficiency. Particularly in modern agricultural production systems, artificial light has been widely applied in new fields such as protected horticulture, intensive livestock & poultry culture, aquaculture and marine fishing, propagation of edible fungi and microalgae, and plant protection by trapping insects etc. Currently, the fundamental & application research of LED in bio-agriculture is very active, and some progress have been achieved in mechanisms of animal and plant responding to light quality, “light recipes” research, and LED light source creation in bio-agriculture and its application demonstration in modern agriculture etc. However, some fundamental theories and industry developmental orientations are needed to be further explored, such as establishing data base of light recipes for bio-agriculture, developing LED lighting facilities with high efficiency for bio-agriculture, jointing LED industry and modern agriculture industrial chain effectively, et al. Bio-agriculture session of SSLCHINA will assemble domestic and foreign experts to focus on the current hot points and leading questions of LED applied in agriculture, discuss the latest progress and development in mechanisms of animal and plant responding to light quality and “light recipes”, and explore new concepts, new technologies, and new achievements in LED combing with modern agriculture such as plant factory, seedling nursery, supplementary lighting in greenhouses, intensive livestock & poultry culture, propagation of edible fungi and microalgae, and plant protection by trapping insets. This session will provide a platform to explore these questions, catch the industry pulse and point out the orientation for the application of LED lighting in modern agriculture.

 

Scope:

- Advances in Biological (Animal and Plant) Responses to Light Qualities

- Bio-Agricultural Light Recipes Technology

- Manufacturing Technology and New Technology of Bio-Agricultural LED Lamps

- Advances in LED Modern Agriculture (Plant Factory, Seedling Nursery, Supplementary Lighting in Greenhouses, intensive livestock & poultry culture, Aquaculture, Marine Fishing, Propagation of Edible Fungi and Microalgae Plant Protection by Trapping Insets)

- Energy Saving Design in LED for Bio-Agriculture

- New Materials and New Technologies of LED for Agriculture

- Design and Optimization of Low Cost LED for Agriculture

 

P207: Light Quality and Lighting for Health

With the rapid advance of LED light and lighting technology, people now strive optimum health and colour quality of light. LED light source is compact and easy control and provides opportunities and challenges for achieving good well-being and visual comfort. With the expanding of application requirements, we can now design better lighting indoor and outdoor environment by optimizing lighting parameters via its control system.

More recently, due to in-depth study on the mechanism and the effect of light on human health and the success of LED device development, application of LED in daily life and well-being have largely increased. It is now becoming a new blue ocean of LED application and leads to new research for better understanding of the impact of lighting on visual development, visual physiology. The conference provides the forum for industrial and academic experts.

As for colour quality, it is also a hot topic in lighting field to achieve good visual comfort in different applications. It is associated with various visual perceptions such as preference, vividness, naturalness, attractiveness, discrimination, etc, beyond the frequently used color fidelity.

 

Scope:

- Photobiological investigation of light radiation damage and health conditioning,

- Mechanism for the Effects of Light on Visual Health,

- New LED Light Source for Health and Medical Applications,

- Quality Evaluation and Application of Light Environment,

- Standardization for Healthy Lighting and Clinical Trials on LED Phototherapy,

- LED Applications in Healthy Lighting and Optical Medicine,

- Light Environmental Design to consider Healthy and Lighting Quality,

- Control Technologies for LED Healthy and Colour Quality Lighting,

- Development and Evaluation of Color Quality Metrics including Color Fidelity, Color Gamut, luminance, CCT, and

- Color Quality metrics for different applications.

 

 

P208: Micro-LED and other Novel Display

Semiconductor light emission devices are the fundamental of displays and solid-state lighting. Novel display and lighting technologies have been well developed these years because of systematically investigation of various light emitting devices, and offer a bright future of versatile applications of information displays and lighting. The devices for novel display and lighting include: Micro-LED, Organic Light Emitting Diodes (OLEDs), Quantum Dot LEDs (QLEDs), LIMO laser, Perovskite LEDs (PerLEDs), and other novel Semiconductor light emitting device. Micro-LEDs have been developing particularly rapidly in recent years. Key technologies of these devices include: light emitting efficiency, brightness/illuminance, working voltage, color gamut, response speed, integration, lifetime and reliability, thermal technology, etc. In terms of system application, novel backplane, drive and control circuit, panel manufacturing process, laser-related technologies, etc.progress of these technologies is very important to novel displays and lighting technologies. Smart pixels and smart displays based on interaction and interaction are gaining attention, integrating Micro-LEDs, detectors, sensors, micro ICs and other unique features into displays to create highly integrated semiconductor information displays (HISIDs) for outstanding performance Interactive and immersive experience

 

Scope:

- Micro-LED Material, Devices, Drive, Characterization and Application Technologies

- OLED Material, Devices, Drive, Characterization and Application Technologies

- Technologies for Laser Display and Lighting

- QLED Material, Devices, Drive, Characterization and Application Technologies

- PerLED and Other Novel Light Emitting Devices

- Advanced Thin Film Technology for Display

- Flexible Backplane and Packaging Technology

- Transparent Conductive Materials

- Circuit Drive and Control Technologies for Novel Diaplay

Highly Integrated Semiconductor Information Displays ( HISID ) Technologies

 

P209: Ultra-Wide Bandgap Semiconductor and other Advanced Semiconductor

In recent years, people continue to get a breakthrough in the research and application of ultra-wide bandgap semiconductor materials represented by diamond, gallium oxide, aluminum nitride, boron nitride, etc. The ultra-wide bandgap semiconductor materials have a larger bandgap, higher thermal conductivity and better material stability, which have significant advantages and great potential for developing new generation of deep ultraviolet optoelectronic devices, high voltage/power electronic devices and other significant applications. This session focuses on the fabrication of the ultra-wide bandgap semiconductor materials, process technology, key equipment and device applications, aims at building a high-quality exchange platform for the communication among industry, academia and capital, discusses the new technologies and new trends of the ultra-wide bandgap semiconductor materials and devices.

 

Scope:

- Key equipment technology for fabrication of the ultra-wide bandgap semiconductors

- Fabrication and material study of the ultra-wide bandgap semiconductors

- Power electronics technology of the ultra-wide bandgap semiconductors

- Optoelectronic device technology of the ultra-wide bandgap semiconductors

- Research and application of other new semiconductor materials

 

 

P210: Technologies for Reliability and Thermal Management

Chip junction temperature has always been an important factor limiting the function and lifetime of semiconductor devices, related thermal management technologies and reliability analysis have been involved from making a single product to managing the entire system. In the process, reliability of the whole system will be affected by advances in technologies such as novel materials for heat dissipation, thermal management technology, reliability oriented design, fault data and failure analysis, control and reliability screening in manufacturing process, accelerated life testing method, failure mode and simulation, etc..

 

Scope:

- Novel Materials for Heat Dissipation

- Thermal Management Technologies

- Reliability Oriented Design

- Fault Diagnosis and Prediction

- Failure Detection and Failure Analysis

- Accelerated Life Testing and Prediction Methods

- Failure Mode and Simulation

- Control and Reliability Screening in Manufacturing Process

 

P301: Technology for Driverintelligent control and smart lighting / Visible Light Communication and 5G connection summit

With the commercialization of 5G products and the launch of 6G research, the informationization and intelligence of the lighting network are more important. This session will focus on energy-saving and long-lasting lighting, and strengthen the application of intelligent control, wireless communication and other technologies in the field of lighting, and explore new forms and related innovative applications of smart lighting systems under the integration of lighting and communication.
Give full play to the functional advantages of the lighting network as the most common infrastructure and China's industrial advantages in the field of semiconductor lighting.  Through cross-industry technical discussions and consensus building, provide platform support for the fields of next-generation information technology, Internet of Things, and smart cities by striving to leapfrog development in

 

 

Scope:

- Power Management and High Efficiency Driving Solutions

- IC New Drive Circuit and Integrated IC

- LED Dimming and Modulating Color Temperature Techniques

- Solution for Controlling of LED Product

- Wireless Communications (ZigBee, Bluetooth, Wifi, Thread, etc.)

- Visible Light Communication Technologies and Applications (Lifi, etc.)

- Integration Of Intelligent Lighting and Smart Home System

- New Interconnection Technologies

- Intelligent LED Lighting System and Sensor Technology

- Modularization and Standardization of Drives

- Network Intelligent Lighting and POE Lighting Technologies

 

REVIEW PROCEDURE

1. Authors must submit extended abstracts in advance.

2. Authors will be informed of paper acceptance with categories of Oral Presentation, Poster Presentation and Conference Proceedings.

3. Authors prepare final submissions depending on the following status:

1)    Oral Presentations: Authors need to prepare paper and presentation files (PPT/PDF)

2)    Poster Presentations: Authors need to prepare paper and poster files (The Technical Program Committee will audit the posters and inform the authors. Authors need to prepare posters according to the template and bring the hardcopy posters to the designated Poster Display area for wall mounting).

3)    Conference Proceedings: Authors should prepare the papers. Authors have to prepare final papers according to the guidelines and given template.

Note:

1)      The template can be downloaded from the paper contribution platform of the forum: http://www.sslchina.org/en/paper/ Authors are required to prepare papers and other materials based on the provided template in time to pass the review successfully.

2)      Full length manuscripts of accepted papers will be published in IEEE Xplore, and Indexed by EI.

 

 

PAPER REQUIREMENTS

1. Basic Requirements

1)    The paper should not have been published in other technical publications or by other technical conferences.

2)    Prominent theme, distinct content, accurate data, rigorous discussion, clear conclusion and adopted legal measurement unit.

2. Abstract Submission

Authors are required to submit extended abstracts according to the paper format template given on the conference website.

3. Paper Format

The paper should be written in APA Format according to the paper format template given on the conference website. The papers should adopt Word format. The total pages of the paper are limited to 4.

4. Language of Abstracts, Posters and Papers

      1)    Abstracts/posters/papers have to be in Standard English.

      2)    Both Chinese and English are acceptable for oral presentations, but only English can be used for the presentation files (PPT/PDF) and conference proceedings.

Note: No commercial promotions allowed for specific companies and products; otherwise, the papers will not be selected for oral presentations and conference proceedings.

 

 

IMPORTANT DATES & METHOD OF SUBMISSION

1. Deadline for abstract submission: July 15th, 2020;

2. Acceptance notification: July 30th, 2020;

3. Deadline for full paper submission: Sep 20th, 2020;

4. Deadline for softcopy submission of presentations PPT and posters: November 20th, 2020.



 

For further questions about the paper submission, please contact us,

Lu BAI

Telephone: 010-82387600-602

Email: papersubmission@china-led.net


Download:

1. Information Form-Abstract Submission

2. Full Paper Template

3. Sample of Full Paper



2019 Conference Proceedings:

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