The
7th International Forum on Wide Bandgap Semiconductors &
The
18th China International Forum on Solid State Lighting
IFWS
& SSLCHINA 2021
www.sslchina.org www.ifws.org.cn
Call
for Papers
The 7th
International Forum on Wide Bandgap Semiconductors & The 18th China
International Forum on Solid State Lighting (IFWS & SSLCHINA 2021) will be
held on November 29- December 1, 2021 at Shenzhen Convention & Exhibition
Center. IFWS & SSLCHINA 2021 is a premier forum for technical and
industrial discussions in all areas of power semiconductor and solid-state
lighting. It aims to promote collaborative innovation of the whole industry
chain including materials growth, equipment, devices and applications in the
related areas.
Accepted papers will
be submitted for inclusion into IEEE Xplore
Date：Nov 29 – Dec 1,
2021
Venue: shenzhen Convention & Exhibition Center -
Guangdong - China
Hosts
China Advanced Semiconductor Industry Innovation
Alliance (CASA)
China Solid State Lighting Alliance (CSA)
CONTENTS
|
Power
Electronics Technologies
and Applications |
• SiC Power Electronics Devices • GaN Power Electronics Devices • Packaging and Reliability of Power
Modules • New Generation Power Supply Technologies
and Applications • Energy Internet Technologies and Applications |
|
RF Electronic Devices Technologies and
Applications |
• GaN RF Electronic
Devices • RF Application
Technologies |
|
Materials
and Equipment |
• SiC
Substrate and Epitaxy • GaN
Substrate and Epitaxy • Ultra-wide
Bandgap Semiconductors Materials • Graphene • Wafer
Growth and other Equipment |
|
Solid State Lighting Technologies and
Applications |
• Technologies for LED
Chip, Packaging, Modules and Reliability • Smart Lighting and Smart City • Landscape Design and Cultural Tourism Lighting • Car Lighting |
|
Micro-LED
and Other Novel Display |
• Mini/Micro-LED
Devices Technologies • Mini/Micro-LED
Applications and Industry • Laser
Display Technology • Perovskite
and Quantum Dots • OLED
and Other Novel Display |
|
Beyond Lighting |
• Health Lighting • Medical Lighting • Light Quality • Technologies for Optical Communication
And Perception • LED Lighting in Bio-Agriculture |
|
Technologies
and Applications for Solid-State Ultraviolet Device |
• Solid-State
Ultraviolet Materials and Device • UV
Module Packaging Technologies • UV-LED
Applications in Photocuring • UV-LED
Applications in Disinfection |
|
Technologies for Reliability and
Thermal Management |
• Defects in nitride
semiconductors • Reliability of New Packing Materials • Thermal Issue & Thermal Management • Product Reliability Estimation • Process Reliability Issue • New Failure Mechanism/ Failure Analysis • Design for Reliability/Analysis &
Modelling • Reliability Challenges
Beyond Illumination |
Chair：
ZHANG Rong (Xiamen University)
Co-Chairs：
LIU Ming (Institute
of Microelectronics, CAS),
GU Ying (PLAGH),
JIANG Fengyi (Nanchang University),
LI Jinmin (Institute of
Semiconductors, CAS),
ZHANG Guoyi (Peking University),
SHEN Bo (Peking University),
QIU Yufeng (Xiamen
University / State Grid),
SHENG Kuang (Zhejiang
University),
ZHANG Bo (University of Electronic
Science and Technology of China),
XU Ke (Suzhou Institute of Nano-tech
and Nano-bionics, CAS),
Kevin J. CHEN (Hong Kong University of
Science and Technology),
Wai Tung NG (University
of Toronto),
ZHANG Guoqi (Delft University of
Technology)
Conveners (In Alphabetical Order)
AO Jinping (University of Tokushima), BAI
Song (Nanjing Electronic Devices Institute), BI Wengang (Jiangsu Institute of
Advanced Semiconductors), BI
Yong （Technical Institute of Physics & Chemistry, CAS）, Bu Weili (SMVIC), CAI Benzhi (Harbin Medical University), CAI Jianqi (China National Institute
of Standardization), CAI Shujun (13th Research Institute of CETC), CHANG
Tianhai (HUAWEI), CHEN Defu (Beijing Institute of Technology), CHEN Mingxiang (Huazhong University
of Science and Technology), CHEN Tangsheng (Nanjing Electronic Devices
Institute), CHEN Xiaolong (Institute of Physics, CAS), CHEN Xiongbin (Institute of Semiconductors, CAS), CHEN Changqing (Huazhong University of
Science and Technology), CHI Nan (Fudan University), CUI Jinjiang (SIBET CAS), DONG Jianfei (SIBET
CAS)，DOU Linping (CSA), DU Zhiyou (Advanced
Micro-Fabrication Equipment), DUAN Lian (Tsinghua University), FENG Gan (EpiWorld
International Co.,Ltd.), GU Ying (PLAGH), KUO Hao-Chung (National Chiao Tung
University), GUO Weiling (Beijing University of Technology), HAO Luoxi (Tongji
University), HE Dongxian (China
University of Agriculture), Hossein Nafari (Mind Optoelectronics), HUANG Kai (Xiamen
University), JIANG Fengyi (Nanchang University), KANG Junyong (Xiamen
University), LI Dabing (Changchun Institute of Optics, Fine Mechanics and
Physics, CAS), LI Gang (Changzhou Xingyu Car Light Co.), LI Guoqiang (South
China University of Technology), Shi-Wei.
Ricky LEE (Hong Kong University of Science and Technology), LI Xiaohang (King Abdullah University
of Science & Technology), LIANG
Huinan (Xinguan Technology), LIAO Liangsheng (Soochow University), LIN Weiming (Fuzhou University), LIN Xinnan (Peking University Shenzhen
Graduate School), LIN Yandan (Fudan University), LIU Bin (Nanjing University), Jay. Guoxu LIU (ShineOn), LIU
Houcheng (South China Agricultural University), LIU Jianli (ZTE), LIU Ming
(Institute of Microelectronics, CAS), LIU Sheng (Wuhan University), LIU Yang
(Sun Yat-sen University), LIU Ying (Dalian Ocean University), LIU Yuhuai
(Zhengzhou University), LIU Zhaojun (Southern University of Science and
Technology), LONG Shibing (University of Science and Technology of China), G.Q.
LU (Virginia Tech), LU Hai (Nanjing University), Ronnier LUO (Zhejiang
University), LUO Xiaobing (Huazhong University of Science and Technology), MA
Dongge (South China University of Technology), MA Songlin (TCL), MO Qingwei
(Elec-Tech International), MOU Tongsheng (Zhejiang University), NIU Pingjuan (Tiangong
University), PAN Jinming
(Zhejiang University), QIU Yufeng (Xiamen University / State Grid), QIU Yun (BOE), QU Jia (WMU Zhejiang Eye Hospital), SHAO Jiaping (ZVISION)、SHEN Bo (Peking University), SHENG Kuang
(Zhejiang University), SUN Guosheng (Institute of Semiconductors, CAS), SUN
Qian (SINANO，CAS), SUN Xiaowei (Southern University of
Science and Technology), TAN
Yizhou (PLAGH), TANG Jingting (13th
Research Institute of CETC), TAO Guoqiao (Ampleon Netherlands B.V), TAO Xutang
(Shandong University), TIAN Pengfei (Fudan University), WANG Hongxing (Xi'an Jiaotong
University), WANG Junxi (Institute of Semiconductors,
CAS), WANG Laili (Xi’an Jiaotong University), WANG Maojun (Peking
University), WANG Xinqiang (Peking University), WANG Yanqing ((Fudan University), WANG Zhiyue (CETC), WEI Minchen (The
Hong Kong Polytechnic University), WU
Jun (NAURA Technology Group), Wai Tung NG (University of Toronto), XIAO Guowei
(APT Electronics), XIONG Daxi (SIBET CAS), XU Hong (LumiGrow, Inc.),
XU Ke SIBET CAS), XU Xiangang (Shandong University), XU Zheng (Beijing
Jiaotong University), XU Zhigang (Nanjing Agricultural University), XU Fujun (Peking
University), YAN Chunhui (Shenzhen Institute of Wide Bandgap Semiconductors), YAN
Qun (Fuzhou University), YANG
Daoguo (Guilin University of Electronic Technology), YANG Hua (Institute of
Semiconductors, CAS), YANG Jianwen (Sun Yat-sen University), YANG Qichang
(Institute of Environment and Sustainable Development in Aguriculture, CAAS), YE Jiandong (Nanjing University), YI
Xiaoyan (Institute of Semiconductors, CAS), YU Hongyu (Southern University of
Science and Technology), YU
Kunshan (CASA), YUN Feng (Xi'an Jiaotong University), ZHANG Bo (University of
Electronic Science and Technology of China), ZHANG Jianli (Nanchang
University), ZHANG Jincheng (Xidian University), ZHANG Junming (Zhejiang
University), ZHANG Naiqian (Dynax Semiconductor), Jon Zhang (Fudan University), ZHANG Yuqiu (Fudan University), ZHANG Yun
(Institute of semiconductors, CAS), ZHAO Degang (Institute of semiconductors,
CAS), ZHAO Jianping (China Academy of Building Research), ZHAO Lixia (Institute of
Semiconductors, CAS), ZHONG Haizheng (Beijing Institute of Technology), ZHU Tao
(Shannon)
IMPORTANT DATES & METHOD OF
SUBMISSION
1. Deadline for abstract submission: August 15th 2021;
2. Paper acceptance notification: August 31st,
2021;
3. Deadline for full paper submission: September 30th,
2021;
4. Full paper acceptance notification: October 15th,
2021;
5. Deadline for softcopy submission of presentations
PPT and posters: November 22nd, 2021.
REVIEW PROCEDURE
1. Authors must submit extended abstracts in
advance.
2. Authors will be informed of paper acceptance with categories of Oral
Presentation, Poster Presentation and Conference Proceedings.
3. Authors prepare final submissions depending on
the following status:
1) Oral Presentations: Authors need to prepare paper
and presentation files (PPT/PDF)
2) Poster Presentations: Authors need to prepare
paper and poster files (The Technical Program Committee will audit the posters
and inform the authors. Authors need to prepare posters according to the
template and bring the hardcopy posters to the designated Poster Display area
for wall mounting).
3) Conference Proceedings: Authors should prepare
the papers. Authors have to prepare final papers according to the guidelines
and given template.
Note:
1)
The template can be downloaded from the paper
contribution platform of the forum: http://www.sslchina.org/paper?lang=en or
http://www.ifws.org.cn/paper?lang=en.
Authors are required to prepare papers and other materials based on the
provided template in time to pass the review successfully.
2)
Full length
manuscripts of accepted papers will be published in IEEE Xplore, and Indexed by
EI.
PAPER REQUIREMENTS
1. Basic Requirements
1) The paper should not have been published in other
technical publications or by other technical conferences.
2) Prominent theme, distinct content, accurate data,
rigorous discussion, clear conclusion and adopted legal measurement unit.
2. Abstract Submission
Authors are required to submit extended abstracts according to the paper
format template given on the conference website.
3. Paper Format
The paper should be written in APA Format
according to the paper format template given on the conference website. The
papers should adopt Word format. The total pages of the paper are limited to 4.
4. Language of Abstracts, Posters and Papers
1)
Abstracts/posters/papers
have to be in Standard English.
2)
Both Chinese and
English are acceptable for oral presentations, but only English can be used for
the presentation files (PPT/PDF) and conference proceedings.
Note: No
commercial promotions allowed for specific companies and products; otherwise,
the papers will not be selected for oral presentations and conference
proceedings.
For further questions about
the paper submission, please contact us,
Lu
BAI
Telephone:
010-82387600-602
Email:
papersubmission@china-led.ne
