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会前购票的所有优惠活动将于11月20日下午17:30结束
大会嘉宾 / GUESTS
齐聚数十位世界各地行业专家、学者、企业家同台论道
CAO Jianlin
CAO Jianlin
Deputy Director of Committee on Education Science, Health and Sport of CPPCC President of ISA, Director of Steering Committee of CASA
Hiroshi Amano
Hiroshi Amano
Foreign academician of Chinese Academy of engineering, member of Japanese Academy of engineering, member of American Academy of engineering, winner of 2014 Nobel Prize in physics, Professor of Institute of future materials and systems, Nagoya University
ZHANG Rong
ZHANG Rong
President and professor of Xiamen University
JIANG Fengyi
JIANG Fengyi
Academician of Chinese Academy of Sciences,Vice President & Professor of Nanchang University
LIU Ming
LIU Ming
Professor at Institute of Microelectronics of Chinese Academy of Sciences; Academician of Chinese Academy of Sciences
WU Ling
WU Ling
Chair of China Solid State Lighting Alliance; Chair of China Advanced Semiconductor Industry Innovation Alliance
LI Jinmin
LI Jinmin
Professor of Institute of Semiconductors, Chinese Academy of Sciences
SHEN Bo
SHEN Bo
Professor of Peking University
Martin DAWSON
Martin DAWSON
Professor of The University of Strathclyde, UK
Kimimori HAMADA
Kimimori HAMADA
Power Semiconductor Consultant of Toyota Motor Corporation, President of PDPlus LLC, General Chair of ISPSD2021
Ioannis (John) KYMISSIS
Ioannis (John) KYMISSIS
Professor & Electrical Engineering Department Chair of Columbia University, USA
Zhang Guoyi
Zhang Guoyi
Director, Professor of Research Center for Wide Bandgap Semiconductor of Peking University
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嘉宾覆盖70多个国家及地区
1800
演讲嘉宾超过1800位
378
举办了378场峰会
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专业观众超过26500位
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提交学术论文2137篇
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新闻动态 / news information
掌握半导体照明及第三代半导体领域有产业发展“风向标”
作为半导体照明及第三代半导体领域有产业发展“风向标”之称的--第十七届中国国际半导体照明论坛暨2020国际第三代半导体论坛(SSLCHINA&IFWS 2020)将于2020年11月23日-25日在深圳会展中心盛大举行。论坛紧扣国家“新基建”、“十四五”等前瞻利好政策,以“把握芯机遇·助力新基建”为主题,论坛程序委员会专家阵容强大,熟知我国发展高科技产业的条件和决心,深谙半导体照明及第三代半导体产业未来发展的问题症结及解决之道。

功率电子器件及封装技术分会主题涵盖碳化硅/氮化镓电力电子器件的新结构与新工艺开发、碳化硅/氮化镓功率电子器件栅驱动设计、高效高速碳化硅/氮化镓功率模块设计与制造,碳化硅/氮化镓封装技术和碳化硅/氮化镓功率应用与可靠性等。分会将邀请国内外知名专家参加本次会议,呈现碳化硅/氮化镓功率电子器件及封装技术研究与应用的最新进展。

超宽禁带半导体技术分会着重研讨超宽禁带半导体材料的制备、工艺技术、关键设备及半导体器件应用,旨在搭建产业、学术、资本的高质量交流平台,共同探讨超宽禁带半导体材料及器件应用发展的新技术、新趋势,积极推动我国超宽禁带半导体材料和器件应用的发展。

由中电化合物半导体有限公司协办的“微波射频与5G移动通信”分会,主题涵盖氮化镓微波器件及其单片集成电路材料外延、建模、设计与制造、可靠性技术及其在移动通信中的应用等各方面。国内外知名专家齐聚,将呈现第三代半导体微波器件及其应用的最新进展。

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